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FSC-BW1001UV Qualcomm QCA6688 Wi-Fi6E&BT5.3 Automotive Module DBDC+LE Audio

FSC-BW1001UV is a Wi-Fi 6E/BT 5.3 automotive DBDC+LE Audio combo module for automotive information and entertainment systems. The module is highly integrated with Qualcomm QCA6688 high-end chipset, it supports 2.4G/5G/6G, 802.11ax, 802.11ac, 802.11a/b/g, 802.11n, 蓝牙 5.3, designed to provide faster, more stable and more secure wireless connection experience.

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  • Wi-Fi 无线局域网:
    • Supports 802.11a/b/g/n/ac/ax Wi-Fi 6E compliant
    • Supports 2x2 Multi-User Multiple-Input Multiple-Output (MU-MIMO)
    • 20MHz/40MHz channel bandwidth for 2.4GHz
    • Dynamic Frequency Selection (DFS, radar detection)
    • Offloading traffic for minimal host utilization at 11ac/ax speeds
    • Integrated close-loop power detector
  • 蓝牙:
    • Compliant with Bluetooth 5.3
    • Supports LE Audio
    • Supports 2 Mbps Bluetooth Low Energy (BLE), BLE long range
    • Split ACL support for A2DP true stereo (earbuds)
    • Dedicated Bluetooth antenna, sharing Bluetooth antenna with WLAN, and concurrent with 5G WLAN
    • Dual eSCO/A2DP streams
    • Supports class 1 and class 2 power-level transmissions without requiring an external power amplifier (PA)
    • Backward-compatible with previous Bluetooth standards
  • General:
    • Integrates Qualcomm QCA6688 automotive chip
    • 23mm × 23mm LGA 112-pin package
    • Support multiple external antennas to acquire enhanced RF performance
    • Supports Android/Linux
    • Host interface:
      • Wi-Fi 无线局域网: PCIe Gen 3 with L1 substate support
      • 蓝牙: HS-UART/I2S/PCM
Wi-Fi 无线局域网
Standard Wi-Fi 6E (IEEE 802.11 a/b/g/n/ac/ax)
Frequency 2.4 GHz / 5 GHz / 6 GHz
Modes STA, AP, Wi-Fi direct (P2P)
Protocols IPv4, IPv6, TCP/IP stack, TCP, UDP, HTTP, MQTT, other custom protocols
天线 Connect to external Feasycom antenna or other antenna

 

 

蓝牙
Standard 蓝牙 5.3 (BR/EDR & LE)
Profiles HFP, A2DP, AVRCP, SPP, PBAP, HID, DUN, FTP, GATT, iAP2, ANCS, other custom profiles
天线 Connect to external Feasycom antenna or other antenna

 

 

General
Chip Qualcomm QCA6688
Dimensions (毫米) 23 × 23 × 2.9
Interfaces PCIe, UART, I2S, PCM
Operating Temperature -40°C ~ +85°C
Storage Temperature -40°C ~ +85°C
Supply Voltage VDD_CORE_VM: 1.35V

VDD_CORE_VH: 1.9V

VDD_PA: 3.8V
VDD_IO: 1.8V
汽车
Datasheet